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Case1:O4—cv-01371-JJF D0cument433—5 Fi|ec|11/21/2006 Page10f3
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Case 1:04-cv-01371-JJF Document 433-5 Filed 11/21/2006 Page 2 of 3
ORRICK, HERRINGTON & SUTCLIFFE LLP
O 1000 MARSH ROAD
Memo PARK, CA 94025
re! 650-614-7400
Mx 650-614-7401
O R R I C K WWW.ORR|C|(.COM
Brn H. VanderZanden
650 614-7629
Ocmbef 2O’ 2006 [email protected]
VIA FEDERAL EXPRESS
Howard G. Pollack
Fish & Richardson P.C.
500 Arguello Street, Suite 500
Redwood City, CA 94036
Re: Power Integrations v. Fairchild Semiconductor et al. (CA 04-1371 IIF 1
Dear Howard:
Following up on my letter of earlier this week, please find the enclosed CDs. The CD that is
Bates labeled I-000411 contains a bond diagram of Mr. Beasom’s prototype wafers. The CD
that is Bates labeled l—000412—414 contains photographs of the prototype wafers and
packaged test—chips. We hope to obtain additional documents from Intersil. We will, of
course, produce them to Power lntegrations as soon as we receive them.
Sincerely,
Brian H. VanderZanden
BI-lV:ma5
cc: William J. Marsden, jr.
Frank E. Scherkenbach
OI IS Wcst:260l12431,l

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