Free Answering Brief in Opposition - District Court of Delaware - Delaware

Case 1:05-cv-00441-JJF Document 243-14 Filed 11/13/2006 Page 1 014

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Tobin of Contents
l .
UNITED STATES
SECURITIES AND EXCHANGE COMIVIISSION
Washington, D.C. 20549
(Mark One)
E3] ANNUAL REPORT PURSUANT TO SECTION 13 OR 15(cl) OF THE SECURITIES
EXCHANGE ACT OF 1934.
For the fiscal year ended December 28, 2003
OR
Ei TRANSITION REPORT PURSUANT TO SECTION 13 OR 15(d) OF THE SECURITIES
EXCHANGE ACT OF 1934.
For the transition period from to
Commission Fiie Number 1-7882
ADVANCED MICRO DEVICES, INC.
(Exact name ol' registrant as specified in its charter)
Belaware 944692300
(State or uiirerjurlstilction eflnaorpuratlun or organization} (I R.S. Employer itientilication No}
One AMD Place, Sunnyvaie, Cuiifornia 94088
(Address of principal executive etfices) (Zip Code)
(408) 749-4000
{Rcglstrnnfs telephone number, Including arm cork:)
Securities registered pursuant to Section 12{b) of the Act:
(Name ofeach exchange
(Title of each class) on which registered}
S Oi Par Va-ine cemfman Stock New York Stoi:-lcFExclaange
Securities registered pursuant to Section 12(g) ot the Act:
None
indicate by check mark whether the registrant (I) has filed all reports required to be filed by Section 13 or i5(cE} of the Securities
Exchange Act of 1934 during the preceding 12 months (or for such shorter period that the registrant was required to file such reports), and (2)
has been subject to such tiling requirements for the past 90 days Yes [ii No El
Indicare by check mark if disclosure of delinquent filers pursuant to Item 405 of Regulation S—I< is not contained lrerein, and will not be
contained. to the best of registrant's knowledge, in deiinitive proxy or infomation statements incorporated by referenrze in Part III of this Form
1G-K or any amendment to this Form 10-K E3

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Table nf Cnntenls
Advanced Micro Devices, Inc,
FORM 10-K.
For The Fiscal Year Ended December 28, 2003
INDEX
PART _; 1
ITEM l BUSINESS 1
ITEM 2 PROPERTIES I6
ITEM 3 LEGAL PROCEEDINGS I6
ITEM 4 SUTBMISSION OF MATTERS TO A VOTE OF SECURITY HOLDERS 17
PART H 33
ITEM 5 MARKET FOR REGISTRANTS COMMON EQUITY AND RELATED STOCICHOLDER MATTERS 18
ITEM 6 SELECTED FINANCIAL DATA 19
ITEM 7 MANAGEMIENT’S DISCUSSION AND ANALYSIS OF FINANCIAL CONDITION AND RESULTS OF
OPERATIONS gg
ITEM 7A UANTITATIVE AND UALITATIVE DISCLOSURE ABOUT MARKET RISK 55
ITEM B. QNANCIAL STAT}E.MEN'1'S AND SUPPLEMENTARY DATA $3
ITEM 9 CHANGES IN AND DISAGREEMENTS WITH ACCOUNTANTS ON ACCOUNTQG AND FINANCIAL
DISCLOSURE 98
ITEM 9A. CONTROLS AND PROCEDURES S8
PART mm 99
ITEM IQ DIRECTORS AND EXECUTIVE OFFICERS OF THE REGISTRANT 99
ITEM 11 EXECUTIVE COMPENSATION QQ
ITEM I2. SECURTTY OWNERSHIP OF CERTAIN BENEFICIAL OWNERS AND MANAQEMENT AND RELATED
STOCKHOLDER MATTERS 99
ITEM I3 CERTAIN ILIELATTONSITIPS AND RELATED TRANSACTIONS 99
ITEM I4 PRINCIPAL ACCOUNTING FEES AND SERVICES 99
PART IV 100
ITEM I5. XI-IIBITS FINANCIAL STATEMENT SCHEDULES AND REPORTS ON
FORM 8—IC 100
SIGNATURES 110
i

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Table of Content;
Manufacturing, Assembly and Test Facilities
Our microprocessor :Eibric:ztion and F.·*~.Sl.. i.LC`s Final: memory fabrication is conducted at ilu: facilities describcai io thc chart below:
\\':at':r Sir: Production Approximate
(Diameter in Technology Clean Room
Fsaitigv {_u;;,q;|;¤ Indies! lin Nanttmetersi tSqu:.trn Fuouusl
Computation Proeércrs `
Dresden, Germany p _ _
Fab 30 , . . ..t L. .1 ” - 8 BQ - .1: 1 l50,Q¤0
F Josh Memory Products _
" N~l$li¤slTQXe'·¤§l .1 . :1 i i tz -1 · 1 . fi. JE *1}: ? { 1. .;` 1
p Fab _ __ I I _ _l30 and if/0 _ @0,000
I l Maas ]»}=;Q}T.L · ‘ i . n 1* 1 A. T .. .. " ua
IVI _ _ _ 8 _ 230 a¤d_320 70,000
1 N2 __ “ r . ·l { "%-ll .E J x 1 8 ’¥ ' ` t. 23ll"Q@‘·Zi i -m `{ 2rZ.,9$ls.ilQ0
IV3 8 130 and 270 118.000
We also have foundry arrangements with third parties for the production of our Personal Connectivity Solutions and chipset products.
The current assembly and test facilities for our microprocessor products are described in the chart set forth below:
Apprnxirnzte
Facility
Facility Location _ _ p _ I p ldgluarelioctzge Activity i
lt==¤¤¤Zj °.‘ s;'M'%ill-lysis "£ `l'' ·· `“ ` ' ·l P? [Trl? ‘ · *7 ` ? E··'l39.Qil0'€¤§1 FEL `Y =` '*1%i¤$¥i¤5lti?& T•=¤¢
Singapore 234.000 rn Test
°" Oftixe total 239,000 square feet, approximately 127,000 square feet is devoted to adm®¤·ative nfdces,.
°° Of the total 234,000 square feet, approzdrmtcly 40,000 square feet is devoted to adminismative and sales otidcesr
Some assembly and tina] testing of our microprocessor products is also performed by subcontractors in the United States and Asia.
The current assembly and test facilities for FASL Ll.C’s Spansion Flash memory products are described in the chart set forth below:
Approximate
Assembly dr Test
facility Location I I > _ ` ` V VV ` I l · ’ Sguare Footage Activigj
Eanglcéiln · · --§f1’ F ` · ` ‘.‘' _ jfij`i’ , Q; ";‘ ·" *·‘7Sf0® ` E]; ’_{§*E, Assexftifigiygg Test
Kettle Mslosis _ _ r . . . 1 - 7 * $99 _. .. Ats=¤¤l¤¤:r el'+.T==s=
? Suzhou, Ci-rim 30,250 Assembly & Test
Some assembly and final testing of FASL LLC’s products is perfomied by subcontractors in Asia, including Fujitsu's final assembly and
testing facility in Kyushu, Japan . l
The political and economic risks associated with operations in foreign countries include:
· cxpropriation;
· changes in a spcciiic country or regiorfs political or economic conditions: -
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